1. 2. 3. material content data sheet sales product name SPA11N80C3 issued 21. september 2015 ma# ma001408794 package pg-to220-3-253 weight* 2136.05 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 9.366 0.44 0.44 4385 4385 leadframe non noble metal iron 7439-89-6 1.431 0.07 670 inorganic material phosphorus 7723-14-0 0.429 0.02 201 non noble metal copper 7440-50-8 1428.770 66.89 66.98 668883 669754 wire non noble metal aluminium 7429-90-5 3.035 0.14 0.14 1421 1421 encapsulation organic material carbon black 1333-86-4 3.325 0.16 1557 plastics epoxy resin - 129.692 6.07 60716 inorganic material silicondioxide 60676-86-0 532.069 24.91 31.14 249090 311363 leadfinish non noble metal tin 7440-31-5 21.731 1.02 1.02 10173 10173 plating non noble metal nickel 7440-02-0 1.786 0.08 0.08 836 836 solder non noble metal antimony 7440-36-0 0.442 0.02 207 noble metal silver 7440-22-4 1.104 0.05 517 non noble metal tin 7440-31-5 2.870 0.13 0.20 1344 2068 *deviation < 10% sum in total: 100.00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. this product is in compliance with eu directive 2011/65/eu (rohs) and does not use any exemption. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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